Acidic copper etching solution and preparation method thereof
The invention discloses an acidic copper etching solution and a preparation method thereof, and belongs to the technical field of metal surface chemical treatment, the acidic copper etching solution comprises the following raw materials by mass: 3-6% of copper chloride, 5-10% of hydrochloric acid, 0...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses an acidic copper etching solution and a preparation method thereof, and belongs to the technical field of metal surface chemical treatment, the acidic copper etching solution comprises the following raw materials by mass: 3-6% of copper chloride, 5-10% of hydrochloric acid, 0.5-1% of lanthanum chloride, 1-3% of sodium chloride, 2-3% of ammonium chloride, 0.01-0.5% of N, N-bis (2-picolyl) ethylenediamine, 2-5% of dithiourea modified chitosan, 0.1-2% of a surfactant, 0.5-1.5% of aza-crown ether, 0.1-2% of N, N-dimethylformamide, 0.1-2% of sodium hydroxide, 0.1-2% of sodium hydroxide, and the balance of water. 4-8% of N, N-dimethylformamide and the balance of deionized water; in the preparation process, the raw materials are mixed according to the proportion, when the acid copper etching liquid is used for etching a liquid crystal panel, the lateral erosion amount can be reduced, the problem that residues exist after complex channels are etched is solved, in addition, the method for prepa |
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