Semiconductor grinding main shaft and semiconductor grinding equipment

The invention discloses a semiconductor grinding main shaft and semiconductor grinding equipment. The semiconductor grinding main shaft comprises a supporting base; the main shaft body is supported on the supporting base through a magnetic levitation device, one end of the main shaft body is used fo...

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Bibliographische Detailangaben
Hauptverfasser:	WEI KEWEN, CAO LINGJUAN, YANG YUEPING, SHAN BAOLIN, ZHANG JUNRAN, ZHU DEBIAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	The invention discloses a semiconductor grinding main shaft and semiconductor grinding equipment. The semiconductor grinding main shaft comprises a supporting base; the main shaft body is supported on the supporting base through a magnetic levitation device, one end of the main shaft body is used for arranging a grinding disc, the magnetic levitation device at least comprises an axial magnetic levitation assembly and a radial magnetic levitation assembly, the axial magnetic levitation assembly is used for providing axial supporting force for the main shaft body, and the radial magnetic levitation assembly is used for providing radial supporting force for the main shaft body. The radial magnetic levitation assembly is used for providing radial supporting force for the main shaft body. The magnetic field is constructed between the main shaft body and the supporting base to generate the interaction force, so that the main shaft body is in a suspension state, rotary supporting without mechanical contact is formed