METAL MEMBER, METAL-RESIN BONDED BODY, AND METHOD FOR

The metal member has a surface having an uneven structure, and satisfies at least one of the following (1)-(3). (1) The surface is covered with a hydrophobic film. (2) the surface has a water contact angle of 90 DEG or more; and (3) the surface is in a state in which an organic compound is chemicall...

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Bibliographische Detailangaben
Hauptverfasser:	MITSUNAGA SHINTARO, KODERA YUTA, HIRAMITSU NORIO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	The metal member has a surface having an uneven structure, and satisfies at least one of the following (1)-(3). (1) The surface is covered with a hydrophobic film. (2) the surface has a water contact angle of 90 DEG or more; and (3) the surface is in a state in which an organic compound is chemically bonded. 金属构件，其具备具有凹凸结构的表面，并满足下述(1)～(3)中的至少一者。(1)前述表面被疏水性膜被覆；(2)前述表面的水接触角为90°以上；(3)前述表面为化学键合有有机化合物的状态。