Molded part with reduced microwave reflection and transmission

Disclosed herein is a multilayer component comprising: a first layer wherein the first layer comprises a first polymer composition comprising a first polymer and from about 0.1 wt.% to about 30 wt.% of a first conductive carbon-based filler; a second layer disposed adjacent to a surface of the first layer, where the second layer includes a second polymer composition including a second polymer and from about 0.01 wt.% to about 10 wt.% of a second conductive carbon-based filler; wherein when the multi-layer component is oriented such that microwave radiation is incident to the second layer of the multi-layer component, the multi-layer component exhibits a reflected power percentage of less than 15% as measured in transmission mode when viewed according to the free space method at frequencies of about 75 GHz to 110 GHz. 本文公开了多层部件，其包括：第一层，其中所述第一层包括第一聚合物组合物，所述第一聚合物组合物包括第一聚合物和约0.1wt.％至约30wt.％的第一导电性碳基填料；第二层，所述第二层邻近所述第一层的表面设置，其中所述第二层包括第二聚合物组合物，所述第二聚合物组合物包括第二聚合物和约0.01wt.％至约10wt.％的第二导电性碳基填料；其中当所述多层部件被定向使得微波辐射入射到所述多层部件的