Three-dimensional integrated circuit with thermoelectric power generation structure and working method thereof

The invention provides a three-dimensional integrated circuit with a thermoelectric power generation structure and a working method thereof, the three-dimensional integrated circuit comprises a substrate, a stacked structure is formed above the substrate, the stacked structure comprises more than two layers of functional chips, at least one peripheral through-silicon-via structure is arranged on the outer side of at least one layer of functional chip, and the peripheral through-silicon-via structure is arranged on the outer side of at least one layer of functional chip. A heat dissipation structure is arranged above the stacking structure; at least one through hole extending in the stacking direction of the stacking structure is formed between the base material and the heat dissipation structure, the through hole penetrates through the functional chip and/or the peripheral silicon through hole structure, at least one power generation chip is arranged in the stacking structure, and the power generation chip is