Semiconductor device and forming method thereof

The semiconductor device package provides thermal consideration of the semiconductor die by providing a thermal module. A substrate including an IC die disposed on the substrate is positioned between an upper plate and a lower plate of the thermal module. The heat pipe connects the upper plate and the lower plate. The thermal module allows a heat dissipation path from the lower plate and the upper plate. In some embodiments, a liquid cooling plate is positioned between a substrate and an upper plate of a thermal module. According to the embodiment of the invention, the invention also provides a semiconductor device and a forming method thereof. 半导体器件封装件通过提供热模块来提供半导体管芯的热考虑。包括设置在衬底上的IC管芯的衬底定位在热模块的上板和下板之间。热管连接上板和下板。热模块允许从下板以及上板的散热路径。在一些实施方式中，液体冷却板定位在衬底和热模块的上板之间。根据本申请的实施例，还提供了半导体器件及其形成方法。