Ceramic tube shell with enhanced heat dissipation capability

The invention provides a ceramic tube shell with enhanced heat dissipation capability, which comprises a metal enclosure frame, the metal enclosure frame is connected with a cavity through solder, an embedded metal wire is arranged in the cavity, the upper end surface of the cavity is connected with...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LUO HAIYANG, SONG WEI, LI JIANHUA, HONG HAO, YAN JUNZHENG, WEN RENJUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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