Ceramic tube shell with enhanced heat dissipation capability

The invention provides a ceramic tube shell with enhanced heat dissipation capability, which comprises a metal enclosure frame, the metal enclosure frame is connected with a cavity through solder, an embedded metal wire is arranged in the cavity, the upper end surface of the cavity is connected with...

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Bibliographische Detailangaben
Hauptverfasser: LUO HAIYANG, SONG WEI, LI JIANHUA, HONG HAO, YAN JUNZHENG, WEN RENJUN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a ceramic tube shell with enhanced heat dissipation capability, which comprises a metal enclosure frame, the metal enclosure frame is connected with a cavity through solder, an embedded metal wire is arranged in the cavity, the upper end surface of the cavity is connected with an inner metal sheet, and the lower end surface of the cavity is connected with a fixed sheet. By adding the metal enclosure frame, embedding the metal wire, adding the inner metal sheet and the fixing sheet and the like, the heat resistance of the product is reduced, the heat capacity of the product is increased, the heat dissipation capability of the tube shell is further improved on the basis of the heat dissipation capability of a traditional ceramic tube shell, and packaging technical support is provided for miniaturization and high density of electronic components; the purpose of improving the load capacity of a traditional ceramic tube shell is achieved, the index and reliability of switch type or power typ