Manufacturing method of probe card converter
The invention provides a manufacturing method of a probe card converter and a probe card, and the method comprises the following steps: S1) providing two layers of ceramic substrates, including a first ceramic substrate and a second ceramic substrate, and respectively processing the two layers of ce...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | SHAO YU YU HAICHAO HOU KEYU |
description | The invention provides a manufacturing method of a probe card converter and a probe card, and the method comprises the following steps: S1) providing two layers of ceramic substrates, including a first ceramic substrate and a second ceramic substrate, and respectively processing the two layers of ceramic substrates to form semi-finished products; s2) respectively sputtering seed layers on the combined surfaces of the first ceramic substrate and the second ceramic substrate, photoetching and developing; s3) respectively electroplating conductive metal on the combined surfaces of the first ceramic substrate and the second ceramic substrate, and then respectively removing photoresist and corroding the seed layer to form a metal welding pad; s4) respectively covering polymers on the bonding surfaces of the first ceramic substrate and the second ceramic substrate; s5) removing the polymer on the conductive metal of the first ceramic substrate and the conductive metal of the second ceramic substrate by adopting a C |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN118641815A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN118641815A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN118641815A3</originalsourceid><addsrcrecordid>eNrjZNDxTcwrTUtMLiktysxLV8hNLcnIT1HIT1MoKMpPSlVITixKUUjOzytLLSpJLeJhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGFmYmhhaGpo7GxKgBAKPNKe0</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Manufacturing method of probe card converter</title><source>esp@cenet</source><creator>SHAO YU ; YU HAICHAO ; HOU KEYU</creator><creatorcontrib>SHAO YU ; YU HAICHAO ; HOU KEYU</creatorcontrib><description>The invention provides a manufacturing method of a probe card converter and a probe card, and the method comprises the following steps: S1) providing two layers of ceramic substrates, including a first ceramic substrate and a second ceramic substrate, and respectively processing the two layers of ceramic substrates to form semi-finished products; s2) respectively sputtering seed layers on the combined surfaces of the first ceramic substrate and the second ceramic substrate, photoetching and developing; s3) respectively electroplating conductive metal on the combined surfaces of the first ceramic substrate and the second ceramic substrate, and then respectively removing photoresist and corroding the seed layer to form a metal welding pad; s4) respectively covering polymers on the bonding surfaces of the first ceramic substrate and the second ceramic substrate; s5) removing the polymer on the conductive metal of the first ceramic substrate and the conductive metal of the second ceramic substrate by adopting a C</description><language>chi ; eng</language><subject>MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; TESTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240913&DB=EPODOC&CC=CN&NR=118641815A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240913&DB=EPODOC&CC=CN&NR=118641815A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHAO YU</creatorcontrib><creatorcontrib>YU HAICHAO</creatorcontrib><creatorcontrib>HOU KEYU</creatorcontrib><title>Manufacturing method of probe card converter</title><description>The invention provides a manufacturing method of a probe card converter and a probe card, and the method comprises the following steps: S1) providing two layers of ceramic substrates, including a first ceramic substrate and a second ceramic substrate, and respectively processing the two layers of ceramic substrates to form semi-finished products; s2) respectively sputtering seed layers on the combined surfaces of the first ceramic substrate and the second ceramic substrate, photoetching and developing; s3) respectively electroplating conductive metal on the combined surfaces of the first ceramic substrate and the second ceramic substrate, and then respectively removing photoresist and corroding the seed layer to form a metal welding pad; s4) respectively covering polymers on the bonding surfaces of the first ceramic substrate and the second ceramic substrate; s5) removing the polymer on the conductive metal of the first ceramic substrate and the conductive metal of the second ceramic substrate by adopting a C</description><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDxTcwrTUtMLiktysxLV8hNLcnIT1HIT1MoKMpPSlVITixKUUjOzytLLSpJLeJhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGFmYmhhaGpo7GxKgBAKPNKe0</recordid><startdate>20240913</startdate><enddate>20240913</enddate><creator>SHAO YU</creator><creator>YU HAICHAO</creator><creator>HOU KEYU</creator><scope>EVB</scope></search><sort><creationdate>20240913</creationdate><title>Manufacturing method of probe card converter</title><author>SHAO YU ; YU HAICHAO ; HOU KEYU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN118641815A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SHAO YU</creatorcontrib><creatorcontrib>YU HAICHAO</creatorcontrib><creatorcontrib>HOU KEYU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHAO YU</au><au>YU HAICHAO</au><au>HOU KEYU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Manufacturing method of probe card converter</title><date>2024-09-13</date><risdate>2024</risdate><abstract>The invention provides a manufacturing method of a probe card converter and a probe card, and the method comprises the following steps: S1) providing two layers of ceramic substrates, including a first ceramic substrate and a second ceramic substrate, and respectively processing the two layers of ceramic substrates to form semi-finished products; s2) respectively sputtering seed layers on the combined surfaces of the first ceramic substrate and the second ceramic substrate, photoetching and developing; s3) respectively electroplating conductive metal on the combined surfaces of the first ceramic substrate and the second ceramic substrate, and then respectively removing photoresist and corroding the seed layer to form a metal welding pad; s4) respectively covering polymers on the bonding surfaces of the first ceramic substrate and the second ceramic substrate; s5) removing the polymer on the conductive metal of the first ceramic substrate and the conductive metal of the second ceramic substrate by adopting a C</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | chi ; eng |
recordid | cdi_epo_espacenet_CN118641815A |
source | esp@cenet |
subjects | MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING |
title | Manufacturing method of probe card converter |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-24T18%3A12%3A22IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SHAO%20YU&rft.date=2024-09-13&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN118641815A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |