Manufacturing method of probe card converter

The invention provides a manufacturing method of a probe card converter and a probe card, and the method comprises the following steps: S1) providing two layers of ceramic substrates, including a first ceramic substrate and a second ceramic substrate, and respectively processing the two layers of ce...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SHAO YU, YU HAICHAO, HOU KEYU
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator SHAO YU
YU HAICHAO
HOU KEYU
description The invention provides a manufacturing method of a probe card converter and a probe card, and the method comprises the following steps: S1) providing two layers of ceramic substrates, including a first ceramic substrate and a second ceramic substrate, and respectively processing the two layers of ceramic substrates to form semi-finished products; s2) respectively sputtering seed layers on the combined surfaces of the first ceramic substrate and the second ceramic substrate, photoetching and developing; s3) respectively electroplating conductive metal on the combined surfaces of the first ceramic substrate and the second ceramic substrate, and then respectively removing photoresist and corroding the seed layer to form a metal welding pad; s4) respectively covering polymers on the bonding surfaces of the first ceramic substrate and the second ceramic substrate; s5) removing the polymer on the conductive metal of the first ceramic substrate and the conductive metal of the second ceramic substrate by adopting a C
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN118641815A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN118641815A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN118641815A3</originalsourceid><addsrcrecordid>eNrjZNDxTcwrTUtMLiktysxLV8hNLcnIT1HIT1MoKMpPSlVITixKUUjOzytLLSpJLeJhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGFmYmhhaGpo7GxKgBAKPNKe0</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Manufacturing method of probe card converter</title><source>esp@cenet</source><creator>SHAO YU ; YU HAICHAO ; HOU KEYU</creator><creatorcontrib>SHAO YU ; YU HAICHAO ; HOU KEYU</creatorcontrib><description>The invention provides a manufacturing method of a probe card converter and a probe card, and the method comprises the following steps: S1) providing two layers of ceramic substrates, including a first ceramic substrate and a second ceramic substrate, and respectively processing the two layers of ceramic substrates to form semi-finished products; s2) respectively sputtering seed layers on the combined surfaces of the first ceramic substrate and the second ceramic substrate, photoetching and developing; s3) respectively electroplating conductive metal on the combined surfaces of the first ceramic substrate and the second ceramic substrate, and then respectively removing photoresist and corroding the seed layer to form a metal welding pad; s4) respectively covering polymers on the bonding surfaces of the first ceramic substrate and the second ceramic substrate; s5) removing the polymer on the conductive metal of the first ceramic substrate and the conductive metal of the second ceramic substrate by adopting a C</description><language>chi ; eng</language><subject>MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; TESTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240913&amp;DB=EPODOC&amp;CC=CN&amp;NR=118641815A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240913&amp;DB=EPODOC&amp;CC=CN&amp;NR=118641815A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHAO YU</creatorcontrib><creatorcontrib>YU HAICHAO</creatorcontrib><creatorcontrib>HOU KEYU</creatorcontrib><title>Manufacturing method of probe card converter</title><description>The invention provides a manufacturing method of a probe card converter and a probe card, and the method comprises the following steps: S1) providing two layers of ceramic substrates, including a first ceramic substrate and a second ceramic substrate, and respectively processing the two layers of ceramic substrates to form semi-finished products; s2) respectively sputtering seed layers on the combined surfaces of the first ceramic substrate and the second ceramic substrate, photoetching and developing; s3) respectively electroplating conductive metal on the combined surfaces of the first ceramic substrate and the second ceramic substrate, and then respectively removing photoresist and corroding the seed layer to form a metal welding pad; s4) respectively covering polymers on the bonding surfaces of the first ceramic substrate and the second ceramic substrate; s5) removing the polymer on the conductive metal of the first ceramic substrate and the conductive metal of the second ceramic substrate by adopting a C</description><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDxTcwrTUtMLiktysxLV8hNLcnIT1HIT1MoKMpPSlVITixKUUjOzytLLSpJLeJhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGFmYmhhaGpo7GxKgBAKPNKe0</recordid><startdate>20240913</startdate><enddate>20240913</enddate><creator>SHAO YU</creator><creator>YU HAICHAO</creator><creator>HOU KEYU</creator><scope>EVB</scope></search><sort><creationdate>20240913</creationdate><title>Manufacturing method of probe card converter</title><author>SHAO YU ; YU HAICHAO ; HOU KEYU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN118641815A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SHAO YU</creatorcontrib><creatorcontrib>YU HAICHAO</creatorcontrib><creatorcontrib>HOU KEYU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHAO YU</au><au>YU HAICHAO</au><au>HOU KEYU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Manufacturing method of probe card converter</title><date>2024-09-13</date><risdate>2024</risdate><abstract>The invention provides a manufacturing method of a probe card converter and a probe card, and the method comprises the following steps: S1) providing two layers of ceramic substrates, including a first ceramic substrate and a second ceramic substrate, and respectively processing the two layers of ceramic substrates to form semi-finished products; s2) respectively sputtering seed layers on the combined surfaces of the first ceramic substrate and the second ceramic substrate, photoetching and developing; s3) respectively electroplating conductive metal on the combined surfaces of the first ceramic substrate and the second ceramic substrate, and then respectively removing photoresist and corroding the seed layer to form a metal welding pad; s4) respectively covering polymers on the bonding surfaces of the first ceramic substrate and the second ceramic substrate; s5) removing the polymer on the conductive metal of the first ceramic substrate and the conductive metal of the second ceramic substrate by adopting a C</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN118641815A
source esp@cenet
subjects MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
title Manufacturing method of probe card converter
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-24T18%3A12%3A22IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SHAO%20YU&rft.date=2024-09-13&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN118641815A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true