Manufacturing method of probe card converter
The invention provides a manufacturing method of a probe card converter and a probe card, and the method comprises the following steps: S1) providing two layers of ceramic substrates, including a first ceramic substrate and a second ceramic substrate, and respectively processing the two layers of ce...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a manufacturing method of a probe card converter and a probe card, and the method comprises the following steps: S1) providing two layers of ceramic substrates, including a first ceramic substrate and a second ceramic substrate, and respectively processing the two layers of ceramic substrates to form semi-finished products; s2) respectively sputtering seed layers on the combined surfaces of the first ceramic substrate and the second ceramic substrate, photoetching and developing; s3) respectively electroplating conductive metal on the combined surfaces of the first ceramic substrate and the second ceramic substrate, and then respectively removing photoresist and corroding the seed layer to form a metal welding pad; s4) respectively covering polymers on the bonding surfaces of the first ceramic substrate and the second ceramic substrate; s5) removing the polymer on the conductive metal of the first ceramic substrate and the conductive metal of the second ceramic substrate by adopting a C |
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