Medium-temperature chemical nickel plating method special for energy-saving circuit board

The invention discloses a special intermediate-temperature chemical nickel plating method for an energy-saving circuit board. The method comprises the following steps: preparing a chemical nickel plating working solution; pretreating a to-be-nickel-plated circuit board; and when the temperature of the chemical nickel plating working solution is increased to the medium temperature of 60-68 DEG C and the pH value is 5.5-6.5, chemical nickel plating operation is carried out on the pretreated circuit board to be subjected to nickel plating for 20 minutes. The process flow of the special intermediate-temperature chemical nickel-plating for the energy-saving circuit board is basically consistent with that of high-temperature chemical nickel-plating, the operation is simple and easy to control, and the difference is that the working temperature of chemical nickel-plating is reduced to the intermediate temperature of 60-68 DEG C from the high temperature of 79-85 DEG C, so that the working temperature of chemical nic