Semiconductor device

The embodiment provides a semiconductor device capable of improving yield. According to one embodiment, a semiconductor device includes a first chip including a first electrode, and a second chip including a second electrode. The first electrode includes a first conductive film and a second conductive film. The first conductive film has a first surface in contact with the second electrode, a second surface facing the first surface, and a third surface between the first surface and the second surface. The second conductive film covers the second surface and the third surface of the first conductive film. The (111) orientation ratio of copper contained in a first portion of the first conductive film on the first surface side is higher than the (111) orientation ratio of copper contained in a second portion of the first conductive film on the second surface side. 实施方式提供一种提高良率的半导体装置。实施方式的半导体装置具备包含第1电极的第1芯片，与包含第2电极的第2芯片。所述第1电极包含第1导电膜与第2导电膜。所述第1导电膜具有与所述第2电极相接的第1面、与所述第1面对向的第2面、及所述第1面与所述第2面之间的第3面。所述第2导电膜覆盖所述第1导电膜的所述第