High heat dissipation features for flip chip structures

A semiconductor package has various heat dissipation features to dissipate heat. The semiconductor package may include an integrated circuit and a non-volatile memory device. A via may be formed in the substrate and filled with a thermally conductive material. A pyrolytic graphite sheet is overlaid on the top surface of the substrate and the through hole. The pyrolytic graphite sheet defines one or more openings that enable the integrated circuit and the non-volatile memory device to be coupled to the top surface of the substrate. The integrated circuit is covered with another thermally conductive material, such as copper or silver paste. And the copper or silver paste also covers the side wall of the pyrolytic graphite flake. The semiconductor package is enclosed by a molding material and a metal layer. The pyrolytic graphite sheet connects the metal layer and the thermally conductive material overlying the integrated circuit to form respective heat dissipation paths. 一种半导体封装具有各种热耗散特征以耗散热量。所述半导体封装可包含集成电路和非易失