SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

An object of the present disclosure is to provide a semiconductor device in which deformation caused by thermal expansion and thermal shrinkage is reduced. The semiconductor device includes a semiconductor element, a case, a beam, and a sealing insulating material. The semiconductor element is mount...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MUTO AYA, KAWAHARA FUMIHITO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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