SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

An object of the present disclosure is to provide a semiconductor device in which deformation caused by thermal expansion and thermal shrinkage is reduced. The semiconductor device includes a semiconductor element, a case, a beam, and a sealing insulating material. The semiconductor element is mounted on the base plate. The housing has a frame shape in plan view. The housing is attached to the base plate. The case accommodates the semiconductor element on the inner side of the frame shape. The beam has a flat plate shape. The beam is held in the housing. The beam covers an inner space, which is a space inside the frame shape of the housing. The sealing insulating material is filled in the internal space of the housing and covers at least a portion of the beam. The beam is provided above the semiconductor element and covers the semiconductor element in plan view. 本公开的目的在于提供减轻由热膨胀以及热收缩引起的变形的半导体装置。半导体装置包括半导体元件、壳体、梁以及密封用绝缘材料。半导体元件安装于基座板。壳体在俯视观察时具有框形状。壳体安装于基座板。壳体在框形状的内侧收容半导体元件。梁具有平板形状。梁保持于壳体。梁遮盖壳体的框形状的内侧的空间即内部空间。密