Reflow furnace bonding structure, reflow soldering bonding scheme determination method and reflow furnace

The invention discloses a reflow oven bonding structure, a reflow soldering bonding scheme determination method and a reflow oven. The reflow furnace bonding structure is arranged in a cooling temperature zone in a furnace chamber. The reflow furnace bonding structure comprises an upper bonding stru...

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Bibliographische Detailangaben

Hauptverfasser:	LIU YANFEI, ZHAO JIAJUN, TIAN JIA, YIN PENGYUE, CHEN XIAOQIANG, SUN YUMING, CHEN GUIFANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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