Reflow furnace bonding structure, reflow soldering bonding scheme determination method and reflow furnace

The invention discloses a reflow oven bonding structure, a reflow soldering bonding scheme determination method and a reflow oven. The reflow furnace bonding structure is arranged in a cooling temperature zone in a furnace chamber. The reflow furnace bonding structure comprises an upper bonding structure and a lower bonding structure which are oppositely arranged in the vertical direction perpendicular to the length of a furnace chamber; according to a preset vacuum degree, the upper bonding structure and the first bonding piece are attached and adsorbed, the lower bonding structure and the second bonding piece are attached and adsorbed, and the upper bonding structure and the lower bonding structure move together in the length direction of the furnace chamber; wherein the first bonding piece and the second bonding piece are welded through welding flux in the vertical direction perpendicular to the length of the furnace chamber to form a bonding piece; the upper bonding structure is used for moving the relati