Photoelectric packaging structure

An optoelectronic package structure is provided. The optoelectronic package structure includes a first photonic component, a second photonic component, and an interposer. The first photonic component is disposed over the second photonic component. The interposer is optically coupled between the firs...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LYU MEIRU, YANG WENJIE, LIN ZHIWEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!