Photoelectric packaging structure

An optoelectronic package structure is provided. The optoelectronic package structure includes a first photonic component, a second photonic component, and an interposer. The first photonic component is disposed over the second photonic component. The interposer is optically coupled between the first photonic component and the second photonic component. The interposer is configured to define a first signal path therebetween. 提供了一种光电封装结构。所述光电封装结构包含第一光子组件、第二光子组件和中介层。所述第一光子组件安置在所述第二光子组件之上。所述中介层光学耦合在所述第一光子组件与所述第二光子组件之间。所述中介层被配置成在其间限定第一信号路径。