METHOD FOR TESTING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE TEST APPARATUS
The invention discloses a method for testing a semiconductor device and a semiconductor device testing apparatus. The method includes providing a semiconductor package including an encapsulant and a plurality of leads protruding from the encapsulant, providing a semiconductor device test apparatus i...
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| creator | NEE WAN KHOO XU SHUNLAI |
| description | The invention discloses a method for testing a semiconductor device and a semiconductor device testing apparatus. The method includes providing a semiconductor package including an encapsulant and a plurality of leads protruding from the encapsulant, providing a semiconductor device test apparatus including a package holder, a plurality of contact test probes, and a lead extender, arranging the semiconductor package within the package holder, actuating the semiconductor device test apparatus such that a first of the contact test probes directly contacts a first of the leads and such that a second of the contact test probes directly contacts the lead extender, and applying a test current to the semiconductor package, a portion of the test current is caused to flow through a first contact test probe that directly contacts the first lead, and another portion of the test current is caused to flow through a second contact test probe that directly contacts the lead extender.
公开了一种用于测试半导体器件的方法和半导体器件测试装置。该方法包括：提供包括密封 |
| format | Patent |
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公开了一种用于测试半导体器件的方法和半导体器件测试装置。该方法包括：提供包括密封</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING |
| title | METHOD FOR TESTING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE TEST APPARATUS |
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