METHOD FOR TESTING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE TEST APPARATUS

The invention discloses a method for testing a semiconductor device and a semiconductor device testing apparatus. The method includes providing a semiconductor package including an encapsulant and a plurality of leads protruding from the encapsulant, providing a semiconductor device test apparatus including a package holder, a plurality of contact test probes, and a lead extender, arranging the semiconductor package within the package holder, actuating the semiconductor device test apparatus such that a first of the contact test probes directly contacts a first of the leads and such that a second of the contact test probes directly contacts the lead extender, and applying a test current to the semiconductor package, a portion of the test current is caused to flow through a first contact test probe that directly contacts the first lead, and another portion of the test current is caused to flow through a second contact test probe that directly contacts the lead extender. 公开了一种用于测试半导体器件的方法和半导体器件测试装置。该方法包括：提供包括密封