Temperature and pressure sensing mechanism for temperature and pressure sensor

The invention relates to the technical field of sensors, in particular to a temperature and pressure sensing mechanism for a temperature and pressure sensor, which comprises a shell, one side of the shell is provided with an electronic component mounting groove, and the bottom wall of the electronic...

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Bibliographische Detailangaben
Hauptverfasser:	ZHU RONGHUI, XI SHENGHANG, GU CHANGFEI, XU WEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS MEASURING MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR PHYSICS TARIFF METERING APPARATUS TESTING
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Beschreibung
Zusammenfassung:	The invention relates to the technical field of sensors, in particular to a temperature and pressure sensing mechanism for a temperature and pressure sensor, which comprises a shell, one side of the shell is provided with an electronic component mounting groove, and the bottom wall of the electronic component mounting groove is provided with a pressure sensing component caulking groove for mounting a pressure sensing component. The temperature sensing assembly penetrates through the temperature sensing assembly through hole; a connector is arranged on the other side of the shell, a port ring groove capable of extending to the end is formed in the connector, and a pressure channel and a temperature sensing assembly mounting ring groove are formed along the bottom wall of the port ring groove; the pressure sensing assembly caulking groove, the pressure channel and the port ring groove are communicated with one another; and the temperature sensing assembly through hole, the temperature sensing assembly mounting