Hot-melt curable silicone composition, sealing material, hot melt adhesive, and optical semiconductor device

The invention provides a hot-melt curable silicone composition, a sealing material, a hot melt adhesive, and an optical semiconductor device. The hot-melt curable silicone composition comprises: (A) a resinous alkenyl group-containing organopolysiloxane that contains at least two alkenyl groups and...

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Bibliographische Detailangaben
Hauptverfasser:	IGUCHI YURI, TAKEUCHI JUNYA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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