Hot-melt curable silicone composition, sealing material, hot melt adhesive, and optical semiconductor device

The invention provides a hot-melt curable silicone composition, a sealing material, a hot melt adhesive, and an optical semiconductor device. The hot-melt curable silicone composition comprises: (A) a resinous alkenyl group-containing organopolysiloxane that contains at least two alkenyl groups and at least one aryl group per molecule and has an aryl group content of 40 mol% or more; (B) a curable linear organopolysiloxane containing at least one aryl group per molecule and having an aryl group content of 40 mol% or more; (C) a curable linear and branched organopolysiloxane containing at least one aryl group per molecule and having an aryl group content of less than 40 mol%; (D) a silicon reactive phase solvent; (E) an organohydrogenpolysiloxane having different components from (D), each molecule having at least two hydrogen atoms bonded to silicon atoms; and (F) a curing catalyst. The hot-melt curable silicone composition has excellent handling properties in a thin film form, exhibits excellent melting prope