Composition for preparing basic cured resin, application of composition, basic cured resin and preparation method and application of basic cured resin
The invention relates to the field of bio-based light and heat curing materials, and discloses a composition for preparing basic cured resin, application of the composition, the basic cured resin and a preparation method and application of the basic cured resin. The composition comprises at least on...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to the field of bio-based light and heat curing materials, and discloses a composition for preparing basic cured resin, application of the composition, the basic cured resin and a preparation method and application of the basic cured resin. The composition comprises at least one compound which is shown in a formula I and contains double bonds at the tail end and at least one sulfydryl-containing monomer; the molar ratio of the compound to the sulfydryl-containing monomer is (0.5-5): 1; and the sulfydryl-containing monomer # imgabs0 # contains more than two sulfydryl groups. The curing composition is cured under light and/or heat conditions and has a high curing rate, and the cured resin prepared from the composition avoids generation of small-molecule incompletely-cured products.
本发明涉及生物基光、热固化材料领域,公开了一种用于制备基础固化树脂的组合物及其应用、基础固化树脂及其制备方法与应用,该组合物包含至少一种式I所示的末端含双键的化合物和至少一种含巯基单体;所述化合物与所述含巯基单体的摩尔比为0.5-5:1;#imgabs0#所述含巯基单体含有2个以上的巯基。该固化组合物在光和/或热条件下实现固化,并且具有高的固化速率,由该组合物制得的固化树脂避免了小分子不完全固化产物的生成。 |
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