Techniques for heat distribution in coupled semiconductor systems

This disclosure describes methods, systems, and apparatus for heat distribution techniques in coupled semiconductor systems. A semiconductor system may be formed by coupling various semiconductor components to each other, and a semiconductor material may also be implemented to support a thermal path having a thermal conductivity relatively close to that of the coupled semiconductor components through the semiconductor system. This semiconductor material may be positioned in areas of the semiconductor system that are otherwise not occupied by functional (e.g., electrically operable) semiconductor components and, in some instances, may be electrically inoperable (e.g., possibly lacking functional circuitry). For embodiments of functional semiconductor component direct coupling (e.g., by fusion bonding or hybrid bonding techniques), the semiconductor material may also be directly coupled with at least one of the semiconductor components. 本公开描述用于经耦合半导体系统中的热分布技术的方法、系统及装置。半导体系统可通过将各种半导体组件彼此耦合来形成，且还可实施半导体材料以支持具有相对接近