SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

The present invention is provided with: a processing chamber having a processing space for processing a substrate; a supporting part which supports the substrate in a horizontal posture and is accommodated in the processing space; a fluid supply unit that supplies a processing fluid to the processin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SHIRAKAWA HAJIME, ANDO KOJI, SUMI NORITAKE, INABA MASAKI, MOTONO TOMOHIRO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING DRYING DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	The present invention is provided with: a processing chamber having a processing space for processing a substrate; a supporting part which supports the substrate in a horizontal posture and is accommodated in the processing space; a fluid supply unit that supplies a processing fluid to the processing chamber and causes the processing fluid to flow in a fixed direction in the processing space; and a fluid discharge portion that discharges the processing fluid from the processing chamber. The support portion has a substrate facing surface facing the lower surface of the substrate and supports the substrate in a state of being separated upward from the substrate facing surface, and the substrate is supported by the support portion in a laminar flow path of the processing fluid flowing between the substrate and the support portion. The downstream path on the downstream side in the fixed direction is wider than the upstream path on the upstream side in the fixed direction. Accordingly, when the liquid is removed f