On-chip distribution of test data for multiple dies

A multi-die integrated circuit [102] uses an on-chip test allocation module to allocate test data [105] to different dies, such as processor chiplets 104, 106, 108, 110]. The test distribution module receives test input data [220] from an external source [115] via one or more integrated circuit pins [112] and distributes the test input data to different dies such that the different dies can simultaneously apply the test data to one or more circuits. Based on the application of the test input data, different dies simultaneously generate corresponding test results [325] that are used to identify and address design or operation errors at the dies. 一种多管芯集成电路[102]使用片上测试分配模块将测试数据[105]分配给不同的管芯，诸如处理器小芯片104,106,108,110]。该测试分配模块经由一个或多个集成电路引脚[112]从外部源[115]接收测试输入数据[220]，并且将该测试输入数据分配给不同的管芯，使得不同的管芯能够同时将该测试数据应用于一个或多个电路。基于该测试输入数据的应用，不同的管芯同时生成对应的测试结果[325]，该测试结果用于识别并解决管芯处的设计或操作错误。