High-frequency power supply module convenient for heat dissipation
The invention relates to the field of power supply modules, and discloses a high-frequency power supply module convenient for heat dissipation, which comprises a shell, first grooves are symmetrically formed in the lower surface of the shell, guide rods are symmetrically and fixedly connected in the...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to the field of power supply modules, and discloses a high-frequency power supply module convenient for heat dissipation, which comprises a shell, first grooves are symmetrically formed in the lower surface of the shell, guide rods are symmetrically and fixedly connected in the first grooves, balls are slidably connected to the outer side walls of the guide rods, and first springs sleeve the outer side walls of the guide rods. The two ends of the first spring are fixedly connected with the opposite sides of the ball and the first groove correspondingly, and a U-shaped connecting piece is slidably connected to the position, located between the two guide rods opposite in the front-back direction, in the first groove. According to the device, the power module body is installed in the shell to play a protection role, a lifting plate is supported through a supporting rod, when the device is affected by vibration, balls are pushed through the supporting rod to extrude a first spring to slide a |
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