Package device and method of forming same

The invention relates to a packaging device and a forming method thereof. A process includes depositing an edge fill dielectric over a first workpiece and a device disposed thereon. The edge fill dielectric is patterned such that only the edge portion remains. A second dielectric material is formed...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CAI RUIXUAN, HUANG CHUQUAN, ZHANG QIAOJUN, YANG SUCHUN, TU JICHENG, LIU CHUNG-XI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!