Package device and method of forming same

The invention relates to a packaging device and a forming method thereof. A process includes depositing an edge fill dielectric over a first workpiece and a device disposed thereon. The edge fill dielectric is patterned such that only the edge portion remains. A second dielectric material is formed over the first workpiece, the device, and the edge fill dielectric. A planarization process flushes the second dielectric material with the device. A bonding layer is formed thereon and a second workpiece is bonded thereto by a dielectric-to-dielectric bond. 本申请涉及封装装置及其形成方法。一种工艺包括在第一工件和设置在其上的装置之上沉积边缘填充电介质。边缘填充电介质被图案化，使得仅边缘部分保留下来。在第一工件、装置和边缘填充电介质之上形成第二介电材料。平坦化工艺使第二介电材料与装置齐平。在其上形成结合层，并通过电介质与电介质键结将第二工件结合到其上。