Resistance welding method, device and equipment for multilayer board
The invention provides a resistance welding method, device and equipment for a multilayer board, and relates to the technical field of welding. The scheme comprises the following steps: determining an upper electrode and a lower electrode of the multilayer board; the upper electrode is in contact wi...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a resistance welding method, device and equipment for a multilayer board, and relates to the technical field of welding. The scheme comprises the following steps: determining an upper electrode and a lower electrode of the multilayer board; the upper electrode is in contact with the first plate, and the lower electrode is in contact with the third plate, so that the upper electrode and the lower electrode press the multi-layer plate; within a first duration, target current is input to the upper electrode and the lower electrode, and the multilayer board is preheated, so that a first nugget is formed on a first target board in the multilayer board; and in a second duration after the first duration, multiple pulse currents are input into the upper electrode and the lower electrode, and the multilayer board is welded, so that a second nugget is formed in the multilayer board. According to the method, welding spatter and burrs caused by overlarge current can be reduced.
本申请提供了一种多层板的电阻焊接方法、装 |
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