Thermally conductive addition-curable silicone composition and cured product thereof
The present invention relates to a thermally conductive addition-curable silicone composition characterized by comprising: (A) an organopolysiloxane having at least one aliphatic unsaturated hydrocarbon group in one molecule and having a kinematic viscosity at 25 DEG C of 60-100,000 mm2/s; (B) a phe...
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| creator | IKENO MASAYUKI HASEGAWA KOJI NONAKA SHIORI KITAZAWA KEITA |
| description | The present invention relates to a thermally conductive addition-curable silicone composition characterized by comprising: (A) an organopolysiloxane having at least one aliphatic unsaturated hydrocarbon group in one molecule and having a kinematic viscosity at 25 DEG C of 60-100,000 mm2/s; (B) a phenol compound in an amount of 0.01-10 mass% with respect to the entire composition; (C) a silver powder in an amount of 10-98 mass% with respect to the entire composition; (D) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to a silicon atom in one molecule, the organohydrogenpolysiloxane being in an effective amount sufficient to form a cured product from the composition; and (E) a platinum group metal catalyst in an effective amount. As a result, it is possible to provide a thermally conductive addition-curable silicone composition having excellent heat dissipation properties.
本发明涉及一种导热性加成固化型有机硅组合物，其特征在于，其包含：(A)有机聚硅氧烷，其1分子中具有至少1个脂肪族不饱和烃基且其25℃下的运动粘度为60~100,000mm2/s；(B)酚化合物，其为相对于组合物整体为0.01~10质 |
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本发明涉及一种导热性加成固化型有机硅组合物，其特征在于，其包含：(A)有机聚硅氧烷，其1分子中具有至少1个脂肪族不饱和烃基且其25℃下的运动粘度为60~100,000mm2/s；(B)酚化合物，其为相对于组合物整体为0.01~10质</description><language>chi ; eng</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240903&DB=EPODOC&CC=CN&NR=118591594A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240903&DB=EPODOC&CC=CN&NR=118591594A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>IKENO MASAYUKI</creatorcontrib><creatorcontrib>HASEGAWA KOJI</creatorcontrib><creatorcontrib>NONAKA SHIORI</creatorcontrib><creatorcontrib>KITAZAWA KEITA</creatorcontrib><title>Thermally conductive addition-curable silicone composition and cured product thereof</title><description>The present invention relates to a thermally conductive addition-curable silicone composition characterized by comprising: (A) an organopolysiloxane having at least one aliphatic unsaturated hydrocarbon group in one molecule and having a kinematic viscosity at 25 DEG C of 60-100,000 mm2/s; (B) a phenol compound in an amount of 0.01-10 mass% with respect to the entire composition; (C) a silver powder in an amount of 10-98 mass% with respect to the entire composition; (D) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to a silicon atom in one molecule, the organohydrogenpolysiloxane being in an effective amount sufficient to form a cured product from the composition; and (E) a platinum group metal catalyst in an effective amount. As a result, it is possible to provide a thermally conductive addition-curable silicone composition having excellent heat dissipation properties.
本发明涉及一种导热性加成固化型有机硅组合物，其特征在于，其包含：(A)有机聚硅氧烷，其1分子中具有至少1个脂肪族不饱和烃基且其25℃下的运动粘度为60~100,000mm2/s；(B)酚化合物，其为相对于组合物整体为0.01~10质</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgJyUgtyk3MyalUSM7PSylNLsksS1VITEnJLMnMz9NNLi1KTMpJVSjOzMkEyqcCFeUW5BeDJRUS81IUgApSUxQKivJBWhVKgIal5qfxMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjU4oLE5NS81JJ4Zz9DQwtTS0NTSxNHY2LUAAAYODnM</recordid><startdate>20240903</startdate><enddate>20240903</enddate><creator>IKENO MASAYUKI</creator><creator>HASEGAWA KOJI</creator><creator>NONAKA SHIORI</creator><creator>KITAZAWA KEITA</creator><scope>EVB</scope></search><sort><creationdate>20240903</creationdate><title>Thermally conductive addition-curable silicone composition and cured product thereof</title><author>IKENO MASAYUKI ; HASEGAWA KOJI ; NONAKA SHIORI ; KITAZAWA KEITA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN118591594A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>IKENO MASAYUKI</creatorcontrib><creatorcontrib>HASEGAWA KOJI</creatorcontrib><creatorcontrib>NONAKA SHIORI</creatorcontrib><creatorcontrib>KITAZAWA KEITA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>IKENO MASAYUKI</au><au>HASEGAWA KOJI</au><au>NONAKA SHIORI</au><au>KITAZAWA KEITA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Thermally conductive addition-curable silicone composition and cured product thereof</title><date>2024-09-03</date><risdate>2024</risdate><abstract>The present invention relates to a thermally conductive addition-curable silicone composition characterized by comprising: (A) an organopolysiloxane having at least one aliphatic unsaturated hydrocarbon group in one molecule and having a kinematic viscosity at 25 DEG C of 60-100,000 mm2/s; (B) a phenol compound in an amount of 0.01-10 mass% with respect to the entire composition; (C) a silver powder in an amount of 10-98 mass% with respect to the entire composition; (D) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to a silicon atom in one molecule, the organohydrogenpolysiloxane being in an effective amount sufficient to form a cured product from the composition; and (E) a platinum group metal catalyst in an effective amount. As a result, it is possible to provide a thermally conductive addition-curable silicone composition having excellent heat dissipation properties.
本发明涉及一种导热性加成固化型有机硅组合物，其特征在于，其包含：(A)有机聚硅氧烷，其1分子中具有至少1个脂肪族不饱和烃基且其25℃下的运动粘度为60~100,000mm2/s；(B)酚化合物，其为相对于组合物整体为0.01~10质</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | Thermally conductive addition-curable silicone composition and cured product thereof |
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