Thermally conductive addition-curable silicone composition and cured product thereof

The present invention relates to a thermally conductive addition-curable silicone composition characterized by comprising: (A) an organopolysiloxane having at least one aliphatic unsaturated hydrocarbon group in one molecule and having a kinematic viscosity at 25 DEG C of 60-100,000 mm2/s; (B) a phenol compound in an amount of 0.01-10 mass% with respect to the entire composition; (C) a silver powder in an amount of 10-98 mass% with respect to the entire composition; (D) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to a silicon atom in one molecule, the organohydrogenpolysiloxane being in an effective amount sufficient to form a cured product from the composition; and (E) a platinum group metal catalyst in an effective amount. As a result, it is possible to provide a thermally conductive addition-curable silicone composition having excellent heat dissipation properties. 本发明涉及一种导热性加成固化型有机硅组合物，其特征在于，其包含：(A)有机聚硅氧烷，其1分子中具有至少1个脂肪族不饱和烃基且其25℃下的运动粘度为60~100,000mm2/s；(B)酚化合物，其为相对于组合物整体为0.01~10质