Integrated heat dissipation module structure
The invention provides an integrated heat dissipation module structure, and the structure at least comprises a metal upper cover plate which comprises a heat dissipation outer surface and a condensation inner surface; the heat dissipation outer surface is provided with a plurality of columnar heat d...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides an integrated heat dissipation module structure, and the structure at least comprises a metal upper cover plate which comprises a heat dissipation outer surface and a condensation inner surface; the heat dissipation outer surface is provided with a plurality of columnar heat dissipation structures, and the condensation inner surface is provided with a plurality of upper grooves which are arranged in parallel. The metal lower cover plate comprises a heat absorption outer surface and an evaporation inner surface; a screw hole is formed in the heat absorption outer surface and is used for locking the heat release electronic element; the evaporation inner surface is provided with a plurality of lower grooves arranged in parallel, a plurality of supporting structures protruding among the lower grooves, and screw hole protruding parts corresponding to the screw holes. The working space is an airtight space formed by mutually jointing an upper frame and a lower frame; the air exhaust channel i |
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