Dynamic imaging system

The described embodiments provide a dynamic imaging system that compensates for pattern defects due to deformation caused by warpage of the substrate. The described methods and apparatus may be used to generate a compensated exposure pattern. The dynamic imaging system includes an inspection system configured to provide a three-dimensional profile measurement of a first substrate and a die offset measurement to an interface configured to provide compensation pattern data to a digital lithography system, the digital lithography system configured to receive the compensation pattern data from the interface, and exposing the photoresist by using the compensation pattern. 所描述的实施方式提供了动态成像系统，所述动态成像系统补偿了由于基板的翘曲引起的变形而导致的图案缺陷。所描述的方法和设备可用于产生补偿曝光图案。动态成像系统包括检查系统，检查系统被配置为将第一基板的三维轮廓测量及裸片偏移测量提供给接口，所述接口被配置为向数字光刻系统提供补偿图案数据，数字光刻系统被配置为从接口接收补偿图案数据，并利用补偿图案曝光光刻胶。