Photosensitive paste

The present invention provides a photosensitive paste in which the width of a wiring pattern is close to the width of a photomask when the photosensitive paste is developed by being irradiated with an active energy ray through the photomask. The photosensitive paste contains an inorganic powder, a p...

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Bibliographische Detailangaben
1. Verfasser: MIYAKE ISAMU
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The present invention provides a photosensitive paste in which the width of a wiring pattern is close to the width of a photomask when the photosensitive paste is developed by being irradiated with an active energy ray through the photomask. The photosensitive paste contains an inorganic powder, a photopolymerizable monomer, an alkali-soluble polymer, and an oxime ester initiator having a diphenyl sulfide group. 本发明提供在隔着光掩模照射活性能量射线进行显影时配线图案的宽度接近光掩模的宽度的感光性糊剂。感光性糊剂包含无机粉末、光聚合性单体、碱溶性聚合物、和具有二苯硫醚基的肟酯系引发剂。