Semiconductor manufacturing process machine and operating method thereof

The invention provides a semiconductor manufacturing process machine and an operating method thereof, the semiconductor manufacturing process machine comprises a plurality of cavities, at least one of the plurality of cavities is a load chamber, the load chamber comprises a bottom surface and a top...

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Bibliographische Detailangaben
Hauptverfasser:	TAN WENYI, ZHU HAIPENG, CHEN MINXIAN, GUO XIJUN, HUANG GUOLIANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The invention provides a semiconductor manufacturing process machine and an operating method thereof, the semiconductor manufacturing process machine comprises a plurality of cavities, at least one of the plurality of cavities is a load chamber, the load chamber comprises a bottom surface and a top cover opposite to the bottom surface; and an inflation pipeline is connected with the top cover of the preloading cavity. 本发明提供一种半导体制作工艺机台及其运作方法，其中该半导体制作工艺机台包含多个腔体，其中多个腔体中的其中至少一个为一预载腔(load lock chamber)，预载腔包含有一底面以及一相对底面的一顶盖；以及一充气管路连接预载腔的顶盖。