Preparation method of boron nitride-vinylidene fluoride-based polymer with core-shell structure
The invention relates to the technical field of high-thermal-conductivity fillers, in particular to a preparation method of a high-thermal-conductivity core-shell structure boron nitride and vinylidene fluoride based polymer filler, boron nitride with a core-shell structure is synthesized by an inno...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to the technical field of high-thermal-conductivity fillers, in particular to a preparation method of a high-thermal-conductivity core-shell structure boron nitride and vinylidene fluoride based polymer filler, boron nitride with a core-shell structure is synthesized by an innovative phase separation method, and a vinylidene fluoride based copolymer is successfully modified on an interface of BN (boron nitride) to prepare the high-thermal-conductivity core-shell structure boron nitride and vinylidene fluoride based polymer filler. The compatibility of the two-dimensional high-thermal-conductivity filler in a polymer matrix is improved; therefore, the high-thermal-conductivity filler prepared in the invention has wide application prospects in the fields of electronic packaging systems, high-voltage electric insulation equipment, high-dielectric capacitors and the like.
本发明涉及高导热填料技术领域,具体涉及一种高导热核壳结构氮化硼@偏氟乙烯基聚合物填料的制备方法,本发明通过创新性地相分离方法合成出具有核壳结构氮化硼,成功地将偏氟乙烯基共聚物修饰在BN的界面上,增加二维高导热填料在高分子基体当中的相容性;因此 |
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