Chip module

The invention provides a chip module, which is arranged on a circuit board and comprises a chip module, a peripheral element module and a pin bonding pad module, the chip module is connected with the peripheral element module; the pin bonding pad module is connected with the chip module and the peripheral element module, and is used for leading out pins of the chip module and interfaces of the peripheral element module; the distance between at least one pair of adjacent pins of the pin bonding pad module is larger than the distance between adjacent pins of the chip module. According to the application, the operation difficulty of the touch chip in the process of accessing the circuit can be reduced, the operation efficiency and the yield can be improved, and the manufacturing cost can be reduced. 本申请提供一种芯片模组，所述模组在电路板上，包括：芯片模块、外围元件模块，以及，管脚焊盘模块；所述芯片模块和所述外围元件模块连接；所述管脚焊盘模块和所述芯片模块，以及，所述外围元件模块连接，用于引出所述芯片模块的管脚，和，所述外围元件模块的接口；所述管脚焊盘模块至少存在一对相邻管脚的间距大于所述芯片模块相邻管脚的间距。本申请可以降低触控芯片在接入电路的过程中的操作难度，提升操作效率，以及，良品率，降低制造成本。