Power module, inverter and vehicle
The invention relates to a power module, an inverter and a vehicle, and the power module comprises a substrate assembly which comprises a first substrate and a second substrate which are arranged at an interval, the first substrate comprises a first conductive layer and a second conductive layer, th...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a power module, an inverter and a vehicle, and the power module comprises a substrate assembly which comprises a first substrate and a second substrate which are arranged at an interval, the first substrate comprises a first conductive layer and a second conductive layer, the second substrate comprises a third conductive layer and a fourth conductive layer, and the second conductive layer is electrically connected with the fourth conductive layer; the chip assembly comprises a plurality of first chips and a plurality of second chips, the plurality of first chips are respectively connected to the first conductive layer and the second conductive layer, and the plurality of second chips are respectively connected to the third conductive layer and the fourth conductive layer; and the terminal assembly comprises a first terminal, a second terminal and a third terminal, the first terminal is electrically connected with the first conductive layer, the second terminal is electrically connecte |
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