Production process of rigid-flex circuit board and rigid-flex circuit board

The invention relates to the technical field of circuit board production, and discloses a production process of a rigid-flex circuit board and the rigid-flex circuit board. A first flexible substrate is fixedly connected with a second rigid substrate and a third rigid substrate on the two sides through adhesives on the two sides; the peripheral edges of the second rigid substrate and the third rigid substrate do not exceed the surface area of the first flexible substrate, and the second rigid substrate and the third rigid substrate are used for welding various electronic elements in the later period, so that the defect that the first flexible substrate cannot be welded with the elements is overcome; the second rigid substrate and the third rigid substrate which are relatively small are arranged on the surface of the larger first flexible substrate, and the second rigid substrate and the third rigid substrate are used as carriers to weld components, so that the components can be welded in the bending process o