SEMICONDUCTOR MANUFACTURING APPARATUS, EDGE DETECTION METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

The invention provides a semiconductor manufacturing apparatus capable of obtaining a reference position with high precision, an edge detection method, and a semiconductor device manufacturing method. The semiconductor manufacturing apparatus includes an identification camera, an illumination device...

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Bibliographische Detailangaben
1. Verfasser: KOBASHI HIDEHARU
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a semiconductor manufacturing apparatus capable of obtaining a reference position with high precision, an edge detection method, and a semiconductor device manufacturing method. The semiconductor manufacturing apparatus includes an identification camera, an illumination device, and a control device. The control device is configured to acquire a width of a position identification mark formed on the first member, to irradiate illumination light to the first member by the illumination device and to capture an image of the first member by the identification camera, and to calculate a shade distribution in the vicinity of the edge based on the image. The second member is irradiated with illumination light by an illumination device and the second member is captured by an identification camera to acquire an image, and the shade distribution in the vicinity of the edge of the position identification mark formed on the second member is calculated on the basis of the image. The position of the ed