Device for reducing clay-metal interface adhesive force of pulse electrolytic tank

The invention discloses a device for reducing clay-metal interface adhesive force through a pulse electrolytic cell, and relates to the technical field of electrochemistry, the device comprises a soil bin arranged on the rear side of a cutter head of a shield tunneling machine, the side, away from the cutter head of the shield tunneling machine, of the soil bin is connected with a hydraulic device, the side, close to the cutter head of the shield tunneling machine, of the soil bin is provided with a heating piece and an electrolysis device, and the heating piece is externally connected with a temperature control device; the electrolysis device comprises a metal electrode anode and a metal electrode cathode which are arranged on the two sides of the soil bin in a partitioned mode, the metal electrode anode and the metal electrode cathode are connected to the discharging device through wires, and a plurality of electrolyte injection holes for spraying electrolyte into the soil bin are formed in a bin body of th