Chip packaging method and chip packaging structure

A packaging method of a chip (30) comprises the following steps: providing a carrier plate (10) which comprises a base body (11) and a plurality of first bonding pads (13) arranged on the base body (11), and forming first solder paste (15) on each first bonding pad (13); a positioning column (20) is...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HUANG ZHIYONG, LIN YUANYU
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:A packaging method of a chip (30) comprises the following steps: providing a carrier plate (10) which comprises a base body (11) and a plurality of first bonding pads (13) arranged on the base body (11), and forming first solder paste (15) on each first bonding pad (13); a positioning column (20) is formed on the surface, provided with the first bonding pad (13), of the base body (11); a chip (30) is provided, the chip (30) comprises a chip body (31) and a plurality of second bonding pads (33) arranged on one surface of the chip body (31), and second solder paste (35) is formed on each second bonding pad (33); a groove (32) is formed in the surface, provided with the second bonding pad (33), of the chip body (31); the positioning columns (20) are accommodated in the grooves (32), each first solder paste (15) is connected with each corresponding second solder paste (35), and the first solder paste (15) and the second solder paste (35) are melted and then solidified to form solder balls (40) which are connected