CURABLE PRECURSORS OF ADHESIVE COMPOSITIONS

The present disclosure relates to a curable precursor of an adhesive composition, the curable precursor comprising a maleimide terminated polyamide-imide polymer. The present disclosure also relates to an adhesive composition comprising a cured adhesive wherein the cured adhesive is a reaction produ...

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Hauptverfasser: KALGUTKAR RAJDEEP S, ROBERTZ RALPH R
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The present disclosure relates to a curable precursor of an adhesive composition, the curable precursor comprising a maleimide terminated polyamide-imide polymer. The present disclosure also relates to an adhesive composition comprising a cured adhesive wherein the cured adhesive is a reaction product of the curable precursor, and to a process for preparing the curable precursor of an adhesive composition, the method includes reacting an amine-terminated polyamide with a bismaleimide by a poly-Michael addition. 本公开涉及一种粘合剂组合物的可固化前体,该可固化前体包含马来酰亚胺封端的聚酰胺-酰亚胺聚合物。本公开还涉及一种粘合剂组合物,该粘合剂组合物包含经固化的粘合剂,其中该经固化的粘合剂是所述可固化前体的反应产物,并且涉及一种用于制备粘合剂组合物的所述可固化前体的方法,该方法包括通过聚迈克尔加成使胺封端的聚酰胺与双马来酰亚胺反应。