Electrostatic chuck and manufacturing method thereof

The electrostatic chuck is provided with: a dielectric substrate in which a first air hole is formed; a chassis in which a second air hole is formed; and a bonding layer that is provided between the dielectric substrate and the chassis and is formed of an insulating material. A first opening, which is an end portion of the first air hole, is formed in the bonding layer-side surface of the dielectric substrate. A second opening, which is an end portion of the second air hole, is formed in a surface on the bonding layer side of the chassis at a position different from that of the first opening. A communication groove for communicating the first opening and the second opening is formed in the surface of the chassis on the bonding layer side. 静电吸盘具备：电介体基板，形成有第1气孔；底盘，形成有第2气孔；及接合层，设置在电介体基板和底盘之间，由绝缘性的材料形成。在电介体基板中的接合层侧的面上，形成有第1气孔的端部即第1开口。在底盘中的接合层侧的面上，在与第1开口不同的位置上，形成有第2气孔的端部即第2开口。在底盘中的接合层侧的面上，形成有使第1开口和第2开口之间连通的连通槽。