Electrostatic chuck and manufacturing method thereof

The electrostatic chuck is provided with: a dielectric substrate in which a plurality of first air holes are formed; a chassis in which a second air hole is formed; and a bonding layer that is provided between the dielectric substrate and the chassis and is formed of an insulating material. First openings, which are the ends of the plurality of first air holes, are formed in the bonding layer-side surface of the dielectric substrate. A second opening, which is an end portion of the second air hole, is formed in a surface on the bonding layer side of the chassis. The second opening communicates with the plurality of first openings through a communication groove formed in the surface of the chassis on the bonding layer side. 静电吸盘具备：电介体基板，形成有多个第1气孔；底盘，形成有第2气孔；及接合层，设置在电介体基板和底盘之间，由绝缘性的材料形成。在电介体基板中的接合层侧的面上，形成有多个第1气孔的端部即第1开口。在底盘中的接合层侧的面上，形成有第2气孔的端部即第2开口。第2开口通过形成在底盘中的接合层侧的面上的连通槽而与多个第1开口连通。