MULTILAYER ELECTRONIC COMPONENT

The present disclosure provides a multilayer electronic component including a body including a plurality of dielectric layers and a plurality of internal electrodes, and external electrodes disposed on the body. The main body includes a capacitance forming portion including the plurality of dielectric layers and the plurality of internal electrodes alternately disposed in a first direction, and cover portions disposed on both surfaces of the capacitance forming portion in the first direction. One of the plurality of dielectric layers includes a first acceptor element including Al, a second acceptor element including at least one of Mg, Mn, and V, and Ti. Each of the one dielectric layer and the cover portion includes a plurality of dielectric grains, and a ratio (G1/G2) of an average size (G1) of the plurality of dielectric grains included in the one dielectric layer to an average size (G2) of the plurality of dielectric grains included in the cover portion satisfies 1.00 < = G1/G2lt; and 1.50. 本公开提供一种多层电子组件，