Temperature and pressure sensor

The invention relates to the technical field of sensors, in particular to a temperature and pressure sensor which comprises a shell, an electronic element mounting groove is formed in one side of the shell, a boss is arranged on the bottom wall of the electronic element mounting groove, a support is...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ZHU RONGHUI, XI SHENGHANG, GU CHANGFEI, XU WEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS MEASURING MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR PHYSICS TARIFF METERING APPARATUS TESTING
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Beschreibung
Zusammenfassung:	The invention relates to the technical field of sensors, in particular to a temperature and pressure sensor which comprises a shell, an electronic element mounting groove is formed in one side of the shell, a boss is arranged on the bottom wall of the electronic element mounting groove, a support is arranged above the boss, a pressure sensing assembly caulking groove for mounting a pressure sensing assembly is formed in the boss, and the pressure sensing assembly caulking groove is connected with the support. The temperature sensing assembly penetrates through the temperature sensing assembly through hole; a terminal through hole and a pressure port seat through hole are formed in the support, a printed circuit board is arranged above the support, the pressure sensing assembly and the temperature sensing assembly are electrically connected with the printed circuit board, and the printed circuit board is electrically connected with an electric connection plug arranged on the outer side of the printed circuit b